More proof the next iPhone is 3G?

Alex Zaharov-Reutt
Monday, 02 June 2008 06:15

Your IT - Mobility

AppleInsider has published details of a possible delay in the 3G iPhone due to the 3.5G HSDPA chip that Infineon produces and is reported to have been chosen to power the 3G iPhone.

AppleInsider quotes an analyst saying: "In our view the profit warning has been caused by ramp changes of next generation iPhone, into which Infineon is supplying the main High-Speed Downlink Packet Access (HSDPA) chipset”.

The analyst said “the delay has resulted in 1.5 million fewer orders for the chipset during Infineon's current quarter.”

Infineon confirmed in a Reuters report it had "received lower orders than expected" for “certain HSDPA chips destined” for a "high-speed Internet phone" but didn’t say which one it was, while also saying chips for a new Nokia phone had also seen orders delayed.

A report in GigaOm says the new GPS chip in the 3G iPhone is being made by Broadcom, and not the SIRF GPS chip provider of SiRFStar III fame, thanks to FCC legal requirements presumably indicating chip details must be disclosed.

Meanwhile, Engadget has published details of the original iPhone patent application, along with an image that looks very familiar to existing iPhone owners.

The patent application, which can be found at the US Patent Office, shows details of the original intentions for the iPhone, including video chat capabilities and more, some of which are now assumed to be on the way in the upcoming 3G iPhone.

Finally, the iPhone can now emulate yet another games platform, this time the TurboGrafx 16 games console, called Temper.

This means the iPhone can now emulate the Palm platform (thanks to StyleTap), the original Nintendo Entertainment System, the GameBoy Advance, the ScummVM emulator to play old Lucasarts and Sierra games, and a PS1/PSX emulator, in addition to the Turbo Grafx 16.

See iPhone Hacks for more details.