Telstra has revealed the addition of almost one million new mobile services in the six months to December 2011, but Sensis revenues plummeted 24 percent in 12 months.
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Adam Turner
Thursday, 15 February 2007 08:02
As of next year IBM will use DRAM for the onboard cache of its 45-nanometer microprocessor line, announced IBM at the International Solid State Circuits Conference in San Francisco.
This new technology, designed using IBM’s Silicon-on-Insulator (SOI) for high-performance at low power, vastly improves microprocessor performance in multi-core designs and speeds the movement of graphics in gaming, networking, and other image intensive, multi-media applications.
By adding DRAM to the processor rather than on a separate chip, IBM hopes to clear one of the key bottlenecks standing in the way of more powerful chips. IBM's eDRAM is now almost as fast as static RAM, but only takes up one-third the space on the chip and consumes one-fifth the standby power.
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