Telstra has revealed the addition of almost one million new mobile services in the six months to December 2011, but Sensis revenues plummeted 24 percent in 12 months.
InSilica, a US-India semiconductor start-up, has obtained second round funding of $18 million to expand its business worldwide and broaden its customer base.
An innovative fabless supplier of high-value and high-volume ASIC and
standard system-on-chip solutions, InSilica was founded on an Indo-US
model where executive and engineering leadership is driven in Silicon
Valley by industry veterans like Vinod Dham (who was on the initial
Intel Pentium team) and a highly skilled and scalable India
development team based in India.
Intel Capital, Flextronics, Crossbow Ventures, Dow Ventures and NewPath Ventures participated in this second round.
After initial financing of $10 milllion about two years ago, the
company spent most of its time in 2004 developing and proving a
proprietary design flow and intellectual property base which enable
solutions that are lower power, higher performance, faster time to
market, and more competitively priced than typical standard ASIC
suppliers were capable of delivering.
In 2005 InSilica focused on a select set of target customers in key
segments such as mobile phones, high performance networking, high
definition video processing, broadband wireless communications who
would find critical value in these differentiators
As a result the company ramped up its production in early 2006. This
customer base includes both traditional systems OEMs as well as other
fabless semiconductor suppliers who chose InSilica for their execution
and delivery as a more effective approach over vertical integration.
“In today’s dynamic, fast-paced competitive market, a clear need exists
for low power, high-performance customized system on chip (SoC)
solutions. InSilica’s products provide customers with cost-effective,
flexible, high volume solutions to satisfy these exact requirements,”
Kumar Shiralagi, Director, Intel Capital India, said.
InSilica will be using the funding to build out its IP portfolio
further, as well as adding scale to its sales and marketing team. The
company intends to maintain a strategic focus on customers so that it
builds a recurring longer term business relationships than those in the
typical customized SOC and ASIC segments.
“InSilica has proven it’s ability to win and deliver on designs that
are pushing the specification limits of what the multitude of typical
standard ASIC companies can provide. We are doing this more cost
effectively and with faster time to market” said Balaji Baktha,
President and CEO of InSilica Corp.
David Bass
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