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HP job cuts loom for Australian employees
A number of Australian employees of Hewlett-Packard are facing the loss of their jobs as the global computer giant looks to slash its worldwide workforce by up to 30,000.
read moreSamsung adopts latest 3D chip stack tech
Peter Dinham
Monday, 23 April 2007 17:43
First IBM, then Intel, now Samsung. The South Korean chip maker today said it too was going to implement the 'Through Silicon Via' (TSV) technique to allow it to stack layers of chip dice more efficiently.
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