Technology news and Jobs
Telecommunications
Fujitsu's 'mobile WiMAX' chips, coming soon
Telecommunications
Fujitsu's 'mobile WiMAX' chips, coming soon | Fujitsu's 'mobile WiMAX' chips, coming soon |
|
| by Stuart Corner | |
| Thursday, 29 June 2006 | |
|
Fujitsu has released details of its mobile WiMAX (IEEE802.16e-2005) chipset. It says commercial products ready for certification will be available in Q3 2007, a timetable determined by the market. Fujitsu's one-chip device, developed by Fujitsu Microelectronics America, is based on Fujitsu's 90nm process technology, and, according to the company, "is especially well-suited for PC cards and mobile devices." "Our mobile WiMAX SoC development and customer evaluation is already underway, and will proceed through the third quarter of 2006. This phase will encompass final identification of target applications and feature sets for early adopter and lead customers, as well as architectural collaboration and chip design finalisation," said Keith Horn, senior vice president of sales and marketing for Fujitsu Microelectronics America. Engineering samples will be available in 1Q 2007. Systems using the Fujitsu mobile WiMAX SoC will be submitted to the WiMAX Forum for certification in 3Q 2007. Horn claimed that the timetable was being set by the market, rather than by Fujitsu's ability to deliver. "Our delivery timetable and feature sets are entirely market-driven. They match the users' readiness for WiMAX mobility. This announcement enables our systems customers to synch up their trial and deployment timelines with our SoC availability." Fujitsu plans multiple releases "to match customers' needs". Its initial release will provide the broadband SoC to deliver MIMO Wave 2 certification compliance. Second and third releases will follow to support full mobility, VoIP and multimedia applications over mobile appliances. |
| < Next story in category | Previous story in the category > |
|---|





Tags




