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Apple patent hints at thinner, lighter notebooks E-mail
by Stephen Withers   
Friday, 18 May 2007
Apple has proposed gluing computer frame and shell components together to allow the production of thinner, lighter yet more rigid notebooks.

The company has set out this idea in a patent application that includes the use of conductive pastes to electrically bond  case components together in order to provide electromagnetic shielding.

The use of glue would, for example, allow the use of a titanium frame with a carbon fibre skin, resulting in a slim, light, strong and rigid assembly. Apple's proposal suggests using a slow-setting glue allowing the components to be established a precise distance apart while it is still liquid. Once the glue hardens, the parts are left in exact alignment and the assembly is far more rigid than the individual parts were.

In addition to allowing the use of thinner and lighter structural materials, this approach also eliminates or at least reduces the need for screws and other fastening hardware, further reducing the weight of the finished product.

Speculation has begun that Apple's rumoured ultramobile computer may use this method of fabrication. As the patent application notes, "Although current enclosure designs work well, in many instances it would be desirable to provide enclosures that are thinner, lighter, stronger and aesthetically more pleasing than current enclosure designs."

One question remains: if you glue the case together, what happens when the electronic components inside need repairing?{moscomment}
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