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Information Technology News IBM answers call of nature with new chip
Information Technology News IBM answers call of nature with new chip | IBM answers call of nature with new chip |
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| by Stephen Withers | |
| Friday, 04 May 2007 | |
  
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The new process involves coating the silicon with a mix of compounds that when baked organise into a uniform structure containing vacuum holes 20nm across and separating the chip's conductors. That uniformity is a result of processes similar to those that create seashells and snowflakes, IBM officials said. The technique has now been proved in IBM's commercial manufacturing line in East Fishkill, New York, to build experimental versions of the POWER6 processor. It will be used in production chips in 2009. "This is the first time anyone has proven the ability to synthesize mass quantities of these self-assembled polymers and integrate them into an existing manufacturing process with great yield results," said Dan Edelstein, IBM Fellow and chief scientist of the self-assembly airgap project.{moscomment} |
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