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IBM uses self-assembling material in chip advance
VIRTUALISATION
IBM uses self-assembling material in chip advance | IBM uses self-assembling material in chip advance |
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| by Peter Dinham | |
| Thursday, 03 May 2007 | |
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SAN FRANCISCO (Reuters) - IBM has developed a way to make microchips run up to one-third faster or use 15 percent less power by using an exotic material that "self-assembles" in a similar way to a seashell or snowflake. Featured Whitepaper
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